Diamond-wire cutting technology contract

Posted on 12 Aug 2017 and read 568 times
Diamond-wire cutting technology contractMeyer Burger Technology of Switzerland has announced the successful conclusion of an important contract for its DW 288 Series 3 diamond-wire cutting platform.

REC Group — an integrated European brand for solar panels — will shift its entire multi-silicon wafer slicing to diamond-wire cutting technology.

The company has selected Meyer Burger’s latest generation cutting equipment for its manufacturing facility in Singapore, following an in-depth technical evaluation.

Valued at around CHF12 million, the contract includes delivery, installation and commissioning, as well as service support and on-site training. The equipment will start to arrive at REC Group in the third quarter of 2017.

Steve O’Neil, CEO of REC Group, said: “As an industry leader for high-power multi-crystalline solar panels, our success is also based on cutting-edge and cost-effective manufacturing technology.

“Choosing Meyer Burger and their diamond-wire cutting technology enables us to continue providing high-quality solar panels.”

Hans Brändle, CEO of Meyer Burger Technology, said: “This important order confirms our excellent long-term relationship with REC and once more demonstrates that our DW 288 Series 3 diamond-wire cutting technology remains the industry-leading solution for the cost-effective production of solar wafers.”

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