Diamond-wire cutting technology contract

Posted on 12 Aug 2017 and read 384 times
Diamond-wire cutting technology contractMeyer Burger Technology of Switzerland has announced the successful conclusion of an important contract for its DW 288 Series 3 diamond-wire cutting platform.

REC Group — an integrated European brand for solar panels — will shift its entire multi-silicon wafer slicing to diamond-wire cutting technology.

The company has selected Meyer Burger’s latest generation cutting equipment for its manufacturing facility in Singapore, following an in-depth technical evaluation.

Valued at around CHF12 million, the contract includes delivery, installation and commissioning, as well as service support and on-site training. The equipment will start to arrive at REC Group in the third quarter of 2017.

Steve O’Neil, CEO of REC Group, said: “As an industry leader for high-power multi-crystalline solar panels, our success is also based on cutting-edge and cost-effective manufacturing technology.

“Choosing Meyer Burger and their diamond-wire cutting technology enables us to continue providing high-quality solar panels.”

Hans Brändle, CEO of Meyer Burger Technology, said: “This important order confirms our excellent long-term relationship with REC and once more demonstrates that our DW 288 Series 3 diamond-wire cutting technology remains the industry-leading solution for the cost-effective production of solar wafers.”

Be seen in all the right places!

MATOF 2017 - Korea Int'l Manufacturing Technology Advanced Engineering UK 2017 Metalex 2017 EUROTOOL 2017 Engimach 2017 Machine Tool Indonesia 2017 Steelfab 2018 Expo Manufactura 2018 WIN Eurasia 2018 MACH 2018 Intermach / MTA 2018 Metaltech 2018

Machinery-Locator
The online search from the pages of Machinery Market.

Bodor Fibre Tube Lasers
Specifications
• T6 L = 6m / D = 20-200mm diameter
• With automated loading & unloading
• Power a
Specifications • T6 L = 6m / D = 20-200mm diameter • With automated loading & unloading • Power a...
World Machinery Ltd