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Poreba TCG 160V-18m
Make: poreba
Type: heavy-duty-roll-lath
Model: TCG 160V 18m
Machine number: 1173-29
Centre dista
Make: poreba Type: heavy-duty-roll-lath Model: TCG 160V 18m Machine number: 1173-29 Centre dista...
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Commercialisation of lightweight nanomaterials

Posted on 14 Aug 2019 and read 1070 times
Commercialisation of lightweight nanomaterialsRedcar-based CPI — a leading technology innovation centre and a founding member of the UK’s High Value Manufacturing Catapult — is contributing its ‘state of the art’ facilities and capabilities to an EU-funded Horizon 2020 project called LEE-BED, focused on creating a test bed for the development and production of lightweight embedded electronics.

The aim is to de-risk and accelerate the development (and manufacture) of nanomaterials and lightweight embedded electronics.

Digitisation of the development and manufacturing of functional nanomaterials and printed components is essential to ensure that Europe can compete with the USA and Asia.

By overcoming challenges such as high costs and limited volume production, the LEE-BED project will provide the infrastructure necessary for the rapid development and pilot production of nanomaterials, inks, adhesives and composites, as well as digitally enabled pilot production lines.

CPI (www.uk-cpi.com) is one of 17 partners in LEE-BED, with each partner bringing unique skills and capabilities in terms of technology innovation.

In particular, CPI’s electronics and formulation capabilities will give the project a range of expertise in inks, adhesives and composite formulation, as well as in printable device fabrication, flexible electronics and electronic system design.

Once the test-bed pilot lines have been developed, CPI will play a leading role in the launch of the open-access LEE-BED test bed in 2021.

The tailored services provided through LEE-BED will enable SMEs, entrepreneurs, start-ups and large enterprises to go from concept to prototype in six months.

Neville Slack, LEE-BED business development manager at CPI, said: “The LEE-BED project and the development of the innovation test bed will contribute to the growth of embedded electronics in Europe by de-risking and accelerating the development of sensors and electronic components.

"It is exciting to be involved in this project and to see the impact that LEE-BED will have on the future of the electronics industry.”