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Siemens partners with Arm

Posted on 01 Feb 2020 and read 804 times
Siemens partners with Arm Siemens Digital Industries Software (www.sw.siemens.com) has announced a partnership with global semiconductor specialist Arm that will bring cutting-edge IP, methodologies, processes and tools together to help automotive manufacturers, integrators and suppliers “collaborate, design and bring to market their next-generation platforms much faster”.

Siemens says the partnership was formed to address the increasingly complex challenges facing the industry “in developing platforms to realise active safety, advanced driver assistance, in-vehicle infotainment, digital cockpits, vehicle-to-vehicle/vehicle-to-infrastructure and self-driving vehicles.

Key advances in computing and sensor technology are enabling companies to redefine mobility, beginning with the integrated circuits and software within automotive electronics systems. The combination of Siemens’ and Arm’s technologies can help auto-makers and suppliers deliver tomorrow’s electronic design and automotive solutions today.”

Siemens’ PAVE360 digital-twin environment, featuring Arm IP, applies “high-fidelity modelling techniques from sensors and ICs to vehicle dynamics and the environment within which a vehicle operates.

“Using Arm IP, including Arm Automotive Enhanced products with safety support, digital-twin models can run entire software stacks providing early metrics of power and performance, while operating in the context of a high-fidelity model of the vehicle and its environment, helping to deliver a new future of mobility.”

Dipti Vachani, Arm’s general manager (Automotive and IoT Line of Business), said: “Developing future transportation solutions requires collaboration across complex ecosystems.

"Arm technology has been deployed in applications across the whole vehicle for more than two decades, and our collaboration with Siemens redefines what is possible in terms of safety-capable, scalable and heterogeneous computing.

“We see this as an important catalyst for the next wave of automotive semiconductor innovation.”