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HP partners with Indo‐MIM to ‘advance metal additive manufacturing’

Posted on 19 Nov 2023 and read 284 times
HP partners with Indo‐MIM to ‘advance metal additive manufacturing’HP Inc recently announced a strategic partnership with Indo-MIM, a ‘major player in the metal injection moulding (MIM) industry and an emerging player in the additive manufacturing (AM) powder industry’. Indo-MIM has initially invested in three HP Metal Jet S100 printers as part of this collaboration, ‘strengthening its commitment to advancing AM globally’.

Two of three 3-D printers will be installed at Indo-MIM’s Bangalore (India) facility; one of them will focus on new material development, while the other will be used for application development and cater to customers in the Middle East, India, and the rest of the Asia-Pacific region. The third unit will be installed in Texas (USA), reinforcing Indo-MIM’s commitment to ‘providing localised support for North American clients and expanding their production capabilities.

Savi Baveja, HP Inc’s president of personalisation and 3-D printing and ‘chief incubation officer’, said: “We are proud to partner with Indo-MIM to create new possibilities for their customers leveraging our S100 solution and metals additive manufacturing capabilities, and work with the company to drive new metals applications, expand material possibilities and increase precision and productivity.”

Krishna Chivukula, Indo-MIM’s CEO, said: “Our partnership with HP signifies a milestone in our journey to provide cutting-edge production ready 3-D metal binder jet solutions to our customers. The acquisition of HP’s Metal Jet S100 printers equips us with the latest technology, enabling us to meet the growing demands of our customers with efficiency and precision, as well as expand the library of materials qualified on the HP printer platform.

“Moreover, HP and Indo-MIM are not only expanding their additive manufacturing capabilities but also working together to qualify new HP Metal Jet materials like M2 tool steel and others that will unlock a broad array of capabilities including improved properties and dimensional tolerances.”