GF Machining Solutions, through its new LASER S 500 U laser ablation machine tool technology, is pioneering an innovative and alternative way forward in the micro-machining of silicon carbide wafers (SiC) over conventional wafer machining methods.
There is global trend towards using silicon carbide (SiC) as an attractive alternative to silicon as a semi-conductor base material especially for applications requiring high power. The popularity of SiC wafers arises from their exceptional thermal conductivity, inherent stability, mechanical strength and wide band gap, enabling electronic components to operate at higher capacities, and deliver improved performance.
SiC wafers have many diverse applications, including converters, inverters, battery chargers and power supplies, and are used across multiple industries such as automotive, renewable energy, telecommunications, defence, and information and communications technology (ICT); essentially high-power electronics and radio-frequency devices.
The use of SiC wafers presents numerous machining challenges for manufacturers across the entire supply chain, from monocrystal growth to IC (Integrated Circuit) packaging. Traditionally, manufacturing processes have been better suited to applications involving silicon (Si). However, machining silicon carbide (SiC) for wafer production involves working with a much harder material using techniques that are not yet fully optimised for this purpose.
Throughout the manufacturing process, SiC wafers, generally 6 to 8 inches in size, are handled multiple times. Their extreme hardness and brittleness significantly increase the risk of chipping, fracturing or breakage. To combat this risk, SiC wafers are given edge profiles (usually R- or F-type) according to SEMI standards. These edge profiles are typically created using diamond wheel grinding, which itself can cause issues such as diamond wheel wear, uneven grinding and improper angle formation. Furthermore, this process is also time-consuming and results in high manufacturing costs.
Unparalleled edge profile qualityGF Machining Solutions’ latest innovation, the LASER S 500 U, revolutionises SiC wafer manufacturing. This advanced laser ablation machine combines high dynamics with precise thermo-regulation, delivering unparalleled edge profile quality, accuracy, and consistency. The machine offers several significant advantages that transform the manufacturing process. Non-contact technology eliminates tool wear, ensures process reliability and maintains consistent quality over long production runs without the risk of breakage.
In terms of efficiency, the LASER S 500 U significantly reduces processing times, from hours to just a few minutes. It also substantially lowers the cost per part by eliminating the need for expensive grinding tools. Additionally, the combination of the machine and GF Machining Solutions’ proprietary CAM software, LaserSUITE360, enables the creation of any edge profile, notch shape or wafer size.
These benefits are achieved through an innovative process that involves a completely integrated solution from CAD/CAM to machining execution, performed at extremely high speeds due to high dynamic movements, innovative machining strategies, and stable accuracy.
The solution enhances wafer processing with advanced features, such as embedded camera technology, that precisely identifies critical areas and reads identification numbers. This allows scraped 8-inch wafers to be quickly re-sized into new 6in wafers, completed with their specific identification numbers, all processed with the same solution.