Henley-on-Thames-based Engis (UK) Ltd, a superabrasives specialist, has introduced the new EVG series of high-precision vertical grinding machines. These new machines have been designed to grind ‘advanced materials’ to a high degree of precision in flatness and surface quality, greatly reducing or even eliminating the need for subsequent lapping, by moving directly from grinding to final polishing of SiC and other materials.

Applications include: semiconductor wafer grinding or back-thinning; and grinding semiconductor equipment components, such as ceramic chucks.

There are three models of Engis EVG machines — the EVG-200, EVG-250 and EVG-300. All incorporate a programmable logic controller, 400rev/min maximum worktable speed, and 2,000rev/min maximum wheel speed. Furthermore, they have been designed with ergonomics in mind, with easy access to the work area — and a variety of chuck options.

Advanced machine control options provide automated grinding wheel dressing, automated positioning of the grinding wheel relative to the workpiece, and workpiece thickness measurement. For maximum control, an upgrade to in-process thickness measurement with feedback to the grinding cycle in real time is also available.

EVG-series machines are equipped with Engis grinding wheels based on the mixed abrasive diamond wheel technology, which tailors the wheel to the material being processed. A video showing the machine at work is can be seen at the website (www.engis.com/videos).