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Mitsui Seiki to showcase a trio of machines at IMTS

Posted on 31 Jul 2024. Edited by: Tony Miles. Read 1008 times.
Mitsui Seiki to showcase a trio of machines at IMTSHU100-TS five-axis Tilt Spindle Machining Centre

Japanese company Mitsui Seiki is showcasing three of its most versatile and accurate machines at IMTS 2024, which takes place 9-14 September in Chicago (Stand 338700). Mitsui Seiki regional sales manager Tyler Bonde is also highlighting Mitsui Seiki technology by teaching visitors how to achieve repeatable accuracy in his conference talk Precision Repeatability: How to Make Great Parts Over and Over and Over Again, taking place at 11am on 11 September.

These cutting-edge machines, used in tandem or on their own, enable users to produce highly accurate parts again and again. First up is the Vertex 55X III – an ultra-high precision Vertex 55X III which can perform multiple functions in one machine, making it ideally suited for aerospace and mould and die work. It is designed for versatility and precision and can be adapted to integrate seamlessly into any machining cell. To demonstrate this, the 55X at IMTS will showcase a field retrofittable pallet system with shared tool capacity, and a total of 12 pallets and 140 tools.

The HU100-TS five-axis tilt spindle machining centre features powerful linear and rotary axes that are configured with a high-torque spindle making it ideal for machining complex parts with precision and consistency. The updated line provides exceptional rigidity and accuracy to profitably mill materials such as titanium, Inconel, stainless steel, and challenging alloys common in aerospace, power generation, defence and other ultra-precision, high-value applications.

Completing the line up is the J350G jig grinder which offers a combination of application flexibility, accuracy, reliability and operator-friendly operation. The grinding infeed stroke is the largest available among all machines in its class. With a U-axis range of -3 to +50mm relative to the spindle centre, this solution provides the versatility to grind small and large diameter holes, as well as free-form complex features, using a single wheel in a continuous, automatic mode.

Daniel Cleary, president of Mitsui Seiki, said: “For nearly a century, our commitment to delivering premier machining technology and exceptional customer service to global manufacturing has been unwavering. Having Tyler Bonde share insights on achieving repeatable precision with conference attendees exemplifies our ongoing dedication to collaboration and doing our part towards advancing the manufacturing industry.”