SolderKing Assembly Materials Ltd, based in Bridlington and a leading UK manufacturer of soldering materials and consumables, will highlight innovations that meet the evolving demands of the electronics industry (Stand J90). Among the products being showcased will be P2-5 SAC305 solder paste, which has been designed specifically for lead-free applications and delivers ‘reliable performance on complex finishes like OSP, ENIG, Ag, Sn, and HASL, while tackling key challenges such as ‘void reduction and stencil performance’.
SolderKing says the paste leaves minimal residue, reducing the need for post-soldering cleaning, while its compatibility with both air and nitrogen reflow systems ensures flexibility and consistent results across various assembly processes.
Also on display will be CXW-70 No Clean cored solder wire. “Engineered for high-speed fast-flowing applications, it offers excellent wetting properties and minimal, non-tacky residue, which enhances workflow efficiency. Moreover, its multiple diameter options make it an ideal choice for precision soldering in varied production environments; and with robotic soldering continuing to gain importance in high-volume manufacturing, this product is engineered to perform consistently under automated conditions, ensuring optimal results every time.”
Chris Ward, SolderKing’s chief operating officer, added: “In today’s electronics industry, where efficiency and precision are key, choosing the right soldering materials can make a significant impact on production speed, quality, and cost. Our products are designed to support both manual and robotic soldering applications, offering reliability, precision, and minimal defects.”