Horizon Microtechnologies GmbH will attend
Space Tech Expo Europe from 18–20 November in Bremen, Germany, marking a major step forward in promoting its space-validated coating and micro 3-D printing technologies for advanced RF and mmWave applications.
The company is seeing growing interest from major satellite OEMs and aims to connect more directly with smaller, agile businesses in the Smallsat, Cubesat, and NewSpace sectors. CEO Andreas Frölich will host meetings during the event and deliver a technology forum presentation on 19 November at 2pm titled ‘Unlocking weight and cost-savings for Smallsats/New Space/Cubesats by replacing metal with metallised polymer’. The presentation is part of Horizon’s engagement with the Green Space Center.
Visitors will find Horizon at the ESA SME stand Q27, where the company will share details of recent test successes, including validation against outgassing, radiation, humidity, thermal shock, and atomic oxygen. These results support Horizon’s ambition to become a trusted supplier of lightweight, space-ready components such as antennas, shielding housings, filters, and wave guides.
Horizon’s CEO Andreas Frölich said: “
Space Tech Expo gives us a perfect platform to show that we are no longer talking theory. We have passed the industry’s toughest environmental tests and we are ready to engage with partners who need functional, weight-saving alternatives to solid metal components, without compromising reliability.”
Horizon’s core technology combines photopolymer-based micro 3-D printing with a proprietary metallisation process, enabling parts with high electrical conductivity, excellent dimensional precision, and weight reductions of 40–80% compared to solid metal. These features align closely with the priorities of new-generation missions, where mass, cost, and functional flexibility are critical.
Mr Frölich concluded: “We are especially eager to meet smaller space players who might not yet know what is possible. With our recent qualification data and the ability to co-design components for robustness and performance, we think the timing is right to open new collaborations.”