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NEPCON Japan returns for 40th anniversary

Posted on 19 Jan 2026. Edited by: Jackie Seddon. Read 206 times.
NEPCON Japan returns for 40th anniversary RX Japan is preparing to stage the 40th edition of NEPCON JAPAN, one of the industry’s most established technology exhibitions, taking place from 21st–23rd January at Tokyo Big Sight. Marking a significant milestone, this year’s show will run alongside three major events — AUTOMOTIVE WORLD, Factory Innovation Week, and the Smart Logistics Expo — creating one of the largest combined technology gatherings in Asia.

Across the three days, organisers expect a turnout of 1,850 exhibitors and around 92,000 visitors, offering a substantial platform for specialists from the electronics, automotive, manufacturing and logistics sectors to meet suppliers, review new technologies and exchange technical insights.

More than 200 technical seminars are scheduled, featuring contributions from leading figures such as Dr. Rao R. Tummala, Emeritus Professor at the Georgia Institute of Technology and Advisor to the Indian Semiconductor Mission. Speakers from major global companies including Rapidus Corp., ASE, Intel, Infineon Technologies Japan, StarPower Semiconductor, Resonac Corp., and the TSMC Japan 3DIC R&D Center Inc. will provide updates on semiconductor innovation, advanced packaging and manufacturing developments.

For four decades, NEPCON JAPAN has established itself as a comprehensive platform for electronics manufacturing, semiconductor processes and advanced packaging technologies. To mark its 40th anniversary, the exhibition will occupy the entirety of the Tokyo Big Sight venue, offering visitors broader access to new products, equipment demonstrations and discussions with industry pioneers.

Masaki Soda, show director, said: “The 40th year of NEPCON JAPAN will be a grand celebration of the global electronics industry that it has grown alongside. With over 1,850 exhibitors from all over the world, the three-day event will serve as a massive showcase of R&D, manufacturing, and packaging technologies, alongside its co-located shows.”