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Poreba TCG 160V-18m
Make: poreba
Type: heavy-duty-roll-lath
Model: TCG 160V 18m
Machine number: 1173-29
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Make: poreba Type: heavy-duty-roll-lath Model: TCG 160V 18m Machine number: 1173-29 Centre dista...
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CAD/CAM software for 3-D printing

Posted on 30 Nov 2019 and read 1511 times
CAD/CAM software for 3-D printingAt the recent EMO exhibition in Hanover, Open Mind Technologies (www.openmind-tech.com) presented its HyperMill Additive Manufacturing suite of software for “satisfying the requirements of industrial 3-D printing processes”.

As a universal software solution, HyperMill — together with this new option — will provide “efficient hybrid processing with simultaneous additive and subtractive processing on a single machine platform”.

HyperMill Additive Manufacturing opens up an array of flexible options for directed energy deposition (DED) processes and wire arc additive manufacturing (WAAM) in terms of highly complex five-axis simultaneous processing.

If 3-D printed parts do not offer the desired precision or support structures have to be removed, the parts can be machined afterwards by means of five-axis machining. Even hard-to-reach areas can be machined in a secure manner using HyperMill.

Volker Nesenhöner, CEO at Open Mind Technologies AG, said: “Our early work on industrial additive-manufacturing processes is now bearing fruit.

“HyperMill Additive Manufacturing allows us to boost the efficiency, precision and process reliability of additive and hybrid manufacturing.

"We want to integrate these new procedures in established process chains, thereby increasing their efficiency and opening up potential applications.

“We can contribute to many innovative solutions and significantly expand the range of applications for these new procedures.”

Typical applications will include: repairing damaged components, such as in mould-making and tool-making; and repairing turbine blades for the aerospace industry.

This software also opens up totally new options for combining different materials, such as when high-quality material layers have to be applied to carrier materials.